Microscopic drops of water cool the heating processor from the inside

Microfluid cooling

Every year, cooling systems of electronic devices are becoming more efficient, which opens the possibility for scientists to create more powerful and complex chips. In the framework of the ICECool research program organized by DARPA, the Lockheed Martin military corporation is developing a new technology for cooling the inside of powerful microchips using microscopic water droplets.

As you know, the electronic devices of the past differed in large sizes, including, due to the cumbersome cooling system. The modern element base and, first of all, the chips “fade” literally “in front of”, which requires completely new approaches when creating cooling systems of a new generation.

According to ICECool’s chief researcher John Dietree, one of the biggest problems so far is the management of heat. If it is solved, then the creation of an electronic device will require less material, and, consequently, the whole system will be more compact and productive.

Microfluid cooling

The micro-liquid cooling system proposed by Lockheed is implemented according to the principles of microfluidics , by integrating directly into the chip microscopic drops of water.

At present, such a system is created for the transmitting antenna as a prototype for further development of the technology. In addition, the company is already working with the manufacturer of Qorvo chips to integrate the cooling system into gallium nitride and gallium arsenide chips.

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